The Thermal and Economic Walls of Monolithic Dies
For half a century, computing advancements relied on the relentless geometric scaling of silicon transistors. As lithography approaches single-nanometer thresholds, quantum tunneling and thermal dissipation have severely curtailed monolithic die expansion. The competitive battleground has consequently shifted upward into advanced packaging.
Heterogeneous chiplet integration, high-bandwidth memory (HBM) stacking, and co-packaged optical interconnects now dictate the throughput economics of modern machine learning clusters.
